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Wafer Process Cleaner PK-CLR Series
Developed for the purpose of removing abrasives after polishing wafers, such as quartz substrates, etc.
Excellent in removing abrasives and preventing the reattachment of those by including the additive that works well for removing special surfactants and inorganic substances.
| Products Name | Type | Application |
|---|---|---|
| PK-CLR2010 | Inorganic Alkali | Inorganic standard type. Excellent in removing abrasives and organic substance. |
| PK-CLR2110 | Inorganic Alkali | Inorganic high-performance type. Specifically excellent in removing abrasives. |
| PK-CLR4040 | Organic Alkali |
Organic standard type. Excellent in removing abrasives. Low foaming type. |
Example of abrasive cleaning test.
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Before cleaning
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After cleaning
