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Chemicals for Packaging Processes
Chemicals for Packaging Processes Contents
A lineup of specialized chemicals optimized for semiconductor and electronic component packaging processes.
Compatible with advanced packaging technologies such as TGV (Through-Glass Via) structure.
Formulation design for surface treatment (Adhesion Promoter) to adsorb components on the substrate surface to enhance adhesion with various material films.
Supports microfabrication processes that require high precision and high reliability.
A lineup of products that take into consideration compatibility with various base materials such as glass, resin, and metal.
【TGV Glass Cleaner】
| Products Name | Type | Features |
|---|---|---|
| PK-LCG255 | Inorganic alkali | Applicable for glass interposers and glass core substrates for packaging. Cleaner can easily be rinsed out. Can be used to clean the inside of microscopic TGVs. Cleaner can easily be rinsed out. Highly effective against various contaminants such as particles and buffer materials. Effectively removes etching residues left inside TGVs. Cleaning is possible without roughening the glass surface. Helps solve problems such as plating defects including voids and poor insulation film adhesion due to contamination. Enhances the permeability of plating solutions into TGVs by cleaning glass surfaces. |
| PK-LCG415 | Organic Alkali |
Compariosn of TGV Glass Cleaning Performance
Comparison of Plating After Cleaning
【Adhesion Promoter】
| Products Name | Type | Features |
|---|---|---|
| PK-STA5041 | Liquid | Enhances adhesion capability of resist, polyimide, and build-up film to Al and Si wafers, glass, etc. Compatible with various coating methods such as spin coating and dip coating. Adhesion layer thickness is only a few nanometres. No heat treatment required. Alternative to HMDS. Can be stored at room temperature. |
Adhesion Enhancement Mechanism
Adhesion-enhancing components are adsorbed on the substrate surface to improve adhesion to the resin film.
