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Cleaner for Photovoltaic Manufacturing Process PK-PVS/PVE/PVX Series
Cleaner for Photovoltaic Manufacturing Process Contents.
【Cleaner for after sliced crystal type silicon ingot】 PK-PVS Series
Water-soluble type and reduce costs at total.
Well for emulsion of cutting fluid and capable of effective cleaning.
Well for removal of scraping and abrasive grain.
Low damage for wafer.
| Products Name | Type | Applicatiion | Feature |
|---|---|---|---|
| PK-PVS606 | Inorganic Alkali | Slurry cleaning | Weak alkaline type Excellent permeability. |
| PK-PVS612N | Organic neutral | Slurry cleaning | Low damage for plate. |
| PK-PVS604G | Inorganic Alkali | Final cleaning | Standard type. |
| PK-PVS615 | Inorganic Alkali |
Final cleaning | Cleaner can easily be rinsed out. |
Water-soluble cutting fluid cleaning example.
before cleaning
PK- PVS612N rough cleaning
PK-PVS604G final cleaning
Oil-based cutting fluid cleaning example.
before cleaning
PK- PVS612N rough cleaning
PK-PVS615 final cleaning
【Cleaner for before texturing of crystalline silicon wafer】 PK-PVE Sries
Effective for formation of texture.
Stain and cleaner can easily be rinsed out and cleaning.
Water-soluble type and reduce costs at total.
| Products Name | Type | Application | Feature |
|---|---|---|---|
| PK-PVE100 | Organic Alkali | Cleaner for before texturing of wafer. | Low expansion, Good rinsing performance. |
| PK-PVE120 | Organic Alkali | Cleaner for before texturing of wafer. | Works well for cleaning organic materials. Effective for persistent stain. |
| PK-PVE130M | Inorganic Alkali | Cleaner for before texturing of wafer. | Effective for removing glove mark, etc. |
PK-PVE100 Cleaning Effect
| Cleaning | No cleaning | |
|---|---|---|
| Wafer |  |
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| SEM(× 1,000) |  |
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【Texture Etching Additives】 PK-PVX501
Applicable to single-crystal silicon.
Usable as an alternative for IPA.
Because of extremely low volatility, the replenishing process indispensable in the IPA method can be eliminated.
Usable for wafers sliced by the fixed abrasive slicing method as well as wafers sliced by the loose abrasive slicing method.
PK-PVX501+KOH (SEM ×1,000)
